ASML provides chipmakers with everything they need – hardware, software and services – to mass produce patterns on silicon through lithography.

The PAS 5500/300C is a DUV wafer stepper made by ASML. It is part of the PAS 5500 platform, which has been a ground-breaking lithography platform for ASML and has been in use for over 30 years. The PAS 5500/300C is a step and repeat exposure system with laser-controlled stage motion. It uses a Zeiss lens with a variable N.A. of 0.63 - 0.40 and a DUV (248 nm) exposure wavelength. It has programmable annular illumination modes and a field size of 22 x 22 mm. It also has 3D-Align backside alignment.

ASML

PAS 5500/300C

Twinscan AT-850C is a Wafer Stepper Machine that can process 12” Wafers in its system capacity.

TWINSCAN AT:850C

TWINSCAN XT:760F

The PAS 5500/350C is a Deep UV stepper for 0.15-μm applications and beyond. The high productivity and low cost of ownership allow capacity extensions in existing DUV stepper fabs as well. The PAS 5500/350C system provides a very cost-effective mix-and-match lithography solution when used in conjunction with other ASML PAS 5500 i-line and DUV steppers.

PAS 5500/350C

TWINSCAN AT:850B

The PAS 5500/850D 248-nm Step-and-Scan system enables 110-nm mass production. Since the initial introduction of the PAS 5500/850, the PAS 5500/850 series have become the worldwide standard for both 110-nm logic and 110-nm memory applications.

The PAS 5500/850D can be configured with a number of options that enable ultra low-k1 in manufacturing, extending application of the PAS 5500/850D well below 110 nm.

PAS 5500/850D

The AT:750 is a 248 nm deep UV system. 
The TWINSCAN platform allows either left- or right-hand configuration for optimum fab layout with track processing equipment and 300 mm automated materials handling systems. The KrF AT:750 is guaranteed for 130nm resolution with 20nm overlay accuracy and has a numerical aperture that is adjustable anywhere from 0.50 to 0.70 for optimal process latitude.

TWINSCAN AT:750

The AT:850B has an industry-leading throughput of 95 300 mm wafers per hour and is the latest addition to ASML's TWINSCAN dual-stage 300 mm lithography platform.

PAS 5500/850B

PAS 5500/350

The TWINSCAN XT:1060K is ASML’s most advanced KrF (krypton fluoride) laser ‘dry’ lithography system.
The TWINSCAN XT:1060K 248 nm step-and-scan system is a dual-stage lithography tool with the highest NA and productivity in the industry, designed for 300 mm wafer production. Extending critical KrF technology reduces our customers' cost per layer while allowing them to benefit from mature KrF processing.

TWINSCAN XT:1060K

ASML's TWINSCAN XT:860M is designed using state-of-the-art optics for volume 300 mm wafer production at and below 110 nm resolution.
The TWINSCAN XT:860M step-and-scan system is a high-productivity, dual-stage KrF lithography machine designed for volume production of 300 mm wafers at below 110 nm resolution.

TWINSCAN XT:860M

PAS 5500/950

PAS 5500/550D

TWINSCAN XT:760

ASML PAS 750 is a DUV scanner which can be used for 8" wafer sizes.

PAS 5500/750

PAS 5500/700B

The TWINSCAN AT:750T was a KrF lithography system, using light with a wavelength of 248 nm and targeted production at the 130 nm node.

TWINSCAN AT:750T

"PAS 5500/700 is a Wafer Steppers System that proceses a wafer size of 3” to 8”. The equipment is a fully automated wafer handling system of 2” with holder capability.The PAS 5500/700 DUV Step & Scan system combines the imaging power of a high numerical aperture (0.7 NA) 4X reduction lens with the latest innovation in illumination technology, the AERIAL II™ Illuminator, to extend KrF lithography down to 150nm. Utilizing ASML's PAS 5500 system architecture and high speed scanning stages, the /700D provides long-term single machine overlay of less than 35nm. The /700D is equipped with a 2KHz, 20W KrF laser, which enables production throughputs of more than 120 200-mm wafers per hour at doses up to 50 mJ/cm2.
The system is equipped with ASML's proven PGA (Phase Grating Alignment) system, and the new ATHENA™ advanced alignment system for improved alignment accuracy on backend process layers including CM processes. The PAS 5500/700 is the ideal system for high volume production of 150 nm design rule IC's."

PAS 5500/700

PAS 5500/950B

PAS 5500/90

PAS 5500/700D

PAS 5500/500

PAS 5500/300B

TWINSCAN XT:1000

The PAS 5500/800 is a deep UV Step & Scan system. The system achieves 120 nm resolution by means of the industry-leading numerical aperture (NA) of 0.80. With throughput of 115 200 mm wafers per hour.

PAS 5500/800

TWINSCAN XT:800K

TWINSCAN XT:860L

First ASML 248nm stepper installed at IMEC (PAS5000/70) Industrial affiliation program on 28nm lithography. 

PAS 5000/70

TWINSCAN XT:1000K

PAS 5500/550B

TWINSCAN NXT:870

TWINSCAN XT:850

TWINSCAN AT:860

TWINSCAN XT:870

TWINSCAN XT:875

ASML PAS 5500 / 850C is a Steppers and Scanners system. The PAS 5500 / 850C ca produce wafer size of 8”.

The PAS 5500/850C 248-nm Step-and-Scan system enables 110-nm mass production. Since the initial introduction of the PAS 5500/850, the PAS 5500/850 series have become the worldwide standard for both 110-nm logic and 110-nm memory applications. The PAS 5500/850C can be configured with a number of options that enable ultra low-k1 in manufacturing, extending application of the PAS 5500/850C well below 110 nm.

PAS 5500/850C

PAS 5500/700C

PAS 5500/550A

The TWINSCAN C product family will be available on four systems: the AT:400C, AT:750C, AT:850C and AT:1150C.

The productivity enhancements in TWINSCAN C increase wafer output to over 110 wafers per hour for 300 mm wafers at real production conditions (109 exposures per wafer). The increased stage speeds in the TWINSCAN platform allow for these productivity improvements while maintaining imaging, alignment and leveling accuracy.

TWINSCAN AT:750C

ASML TWINSCAN XT:850F is a Steppers and Scanners system. The TWINSCAN XT:850F can produce wafer size of 12. XT systems were 25% smaller than their AT equivalents yet delivered the same or better performance.

TWINSCAN XT:850F

The PAS 5500/550D DUV Step & Scan system has a variable NA (0.40 to 0.63) 4x projection lens, which combined with ASML's AERIAL™ Illuminator provides 180nm resolution. Long-term production overlay is less than 40nm. This system comes with a 2kHz 20W laser resulting in a 1200mW/cm2 intensity and >115wph throughput for an extremely wide range of DUV resist sensitivities. The PAS 5500/550D Step & Scan system’s resolution, overlay and productivity ensures the lowest operating cost for advanced DUV lithography

PAS 5500/550

With an 0.80 NA, the TWINSCAN XT:860N is our new-generation KrF system, supporting high-volume 200 mm and 300 mm wafer production at and below 110 nm resolution

TWINSCAN XT:860N

PAS 5500/750G

TWINSCAN XT:800

PAS 5500/50

S850 DUV

TWINSCAN AT:700S

The PAS 5500/8TFH-A KrF Step-and-Scan system is a dedicated lithography tool for thin-film head (TFH) production on 125-mm, 150-mm, and 200-mm AlTiC wafers.

PAS 5500/8TFH-A

TWINSCAN AT:750F

The PAS 5500/750E DUV Step & Scan system enables 130nm mass production using mature 248nm KrF technology. This is made possible by advancements in all major subsystems of the PAS 5500 system, resulting in the required imaging and overlay performance. The PAS 5500/750E combines the imaging power of the improved 0.7 NA 4x reduction lens with the latest innovations in the AERIAL II™ illumination technology, including QUASAR™ multipole illumination and optional multiple exposure capability. The system is equipped with the proven TTL alignment system as well as with ATHENA ™ for improved alignment accuracy on backend process layers, providing a long term single machine overlay of less than 30nm. A 2kHz 20W KrF laser with Variable Laser Frequency Control in combination with the high speed scanning stages and the high optical transmission of the complete system provide a production throughput of 120 200mm wph with the lowest possible laser Cost of Operation.

PAS 5500/750E

TWINSCAN XT:860

DUV Step and Scan

The PAS 5500/750F DUV Step-and-Scan system enables 130-nm mass production using mature 248-nm KrF technology. It combines the imaging power of the improved 0.7 NA 4x reduction lens with the latest multi-spot innovations in the leveling system and the AERIAL II illumination technology including QUASAR, multipole illumination and optional multiple exposure capability. The system is equipped with both TTL alignment and ATHENA for improved alignment accuracy on backend process layers, providing a long term single machine overlay of less than 25 nm.

PAS 5500/750F

The PAS 5500/300C is capable of processing 88 200 mm wafers per hour. The stepper incorporates an AERIAL Illuminator, which allows extendibility beyond 0.25 µm without compromising the excellent imaging performance and high productivity. This allows quick start-up of deep UV processes needed to fabricate high-density IC’s, including: shrink 64-megabit memory chips, 256-megabit DRAMs and P6- and P7-generation microprocessors.

PAS 5500/300

PAS 5500 / 850 is a step-and-scan system manufactured by ASML. The PAS 5500/850D 248-nm Step-and-Scan system enables 110-nm mass production. Since the initial introduction of the PAS 5500/850, the PAS 5500/850 series have become the worldwide standard for both 110-nm logic and 110-nm memory applications. The PAS 5500/850D can be configured with a number of options that enable ultra low-k1 in manufacturing, extending application of the PAS 5500/850D well below 110 nm.

PAS 5500/850

The ASML AT 850 is a Steppers and Scanners system. The ASML AT 850 can be used with 248mm Krf stepper size and wafer stage size is 3".

The birth of the TWINSCAN platform in 2000 introduced the world to the first dual-wafer stage, still the only dual-stage platform in volume production today. AT:850, had a larger NA, 0.80, allowing imaging to be pushed to 100 nm. 

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热门 ASML 248nm DUV

TWINSCAN AT:850C

PAS 5500/300C

TWINSCAN AT:850B

PAS 5500/350C

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全部 ASML 248nm DUV