概述

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber. - Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber - RF biased electrode option available for control of film properties - Industry-standard cassette to cassette handling for higher throughput - Maximum flexibility in the choice of precursors, process gases, hardware features and options - Optimised to maintain low-damage, high-quality substrates - Removable liners allow for easy chamber maintenance -Low temperature to enable high-quality deposition on temperature-sensitive surfaces