ACCRETECH next generation systems support optimum device productions.

ACCRETECH / TSK

A-WD-75A

HRG3000RMX

ACC300

MHF4000EX

ML300EX-WH

MHF6000

MHF400

The C-RW-200A is a Sliced Wafer Carbon Demounting and Cleaning Machine. It is designed to automatically demount wafers from the slicing base, clean them, and store them into a cassette. This machine streamlines the process of handling sliced wafers, making it more efficient and reducing the risk of damage to the wafers.

C-RW-200A

Accretech prober with high-speed probing that targets non-memory device

UF 3000 OMEGA

A-WD-10B

ML300Plus-RM

ML300-RM

AL300P

AltaPlov

PG3000RMX2

High-precision XYZ control system with minimum footprint and high throughput This machine provides excellent operability by color liquid crystal touch panel and compliant with optical device and high luminance LED measurement. 

UF50

AD3000T-HC PLUS

E-ST-VS21A-1

ML300Plus-FHWH

ML300EX

E MF1000 100

AD3000T-PLUS 

***PARTS***

The FP200A is a probing machine made by ACCRETECH / TSK. It performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Some of the features of the FP200A probing machine include: It performs precision measurement using ACCRETECH’s unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Optimization of correction value is realized by the application software which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

FP200A

A-WS-100A

UF200SA/FL

It has a newly developed XY stage drive unit and a new calculation procedure for a very high throughput. It also has an improved Z-platform for the highest probe power, which allows for even contact on high pin count probe cards with large surfaces. Additionally, it has a highly stable Z-axis with a large surface spindle cleaning unit and a 15 inch LCD touch screen for easy operation. The Optical Target Scope (OTS) allows for very precise measurements of the relative positions of Probe Cards and Chucks. The UF3000EX-HS is designed for high-speed testing and offers advanced features to enhance productivity and accuracy.

UF3000EX-HS

MHF9000EX

The W-SL-300 is a Wire Saw Slicing Machine that is designed for high-throughput slicing of plural wafers at a time. It is capable of slicing large-diameter ingots up to 300 mm, providing high-precision and high-processing quality while maintaining high-productivity. Additionally, the W-SL-300 is an economical machine with a small footprint and low running costs, making it an ideal choice for businesses looking to maximize their efficiency and productivity.

W-SL-300

DH-150	

WIN-WIN 50 A5000

MHF410

The PG3000RMX is a Polish Grinder manufactured by ACCRETECH - TOKYO SEIMITSU. It is designed for simultaneous thinning and defect removal of wafers up to 300 mm. It performs the processes of rough grinding, fine grinding, polishing, and cleaning wafers on both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table. It has a high throughput for 15 µm wafer thinning in high volume production.

PG3000RMX

ML300EX-FHWH

MEP-2500

SURFCOM 578A

The ACCRETECH / TSK UF200DR is a Prober system. The UF200DR can be used with 200mm wafer sizes. 

UF200DR

HRG300

MHF300S	

A-PM-60B

MHF400R

A-WD 300TLDP

AP3000

Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality.

A-CS-300

PG300

ML301EX-WH

ChaMP 332

HRG300A

A-WS-100B

ML300Plus-FH

PS300

PG200

ML300PlusX-RM

The UF200D is a machine that features parallel processing with dual-stages. This allows for efficient and simultaneous processing of multiple tasks, resulting in increased productivity and faster completion times. 

UF200D

ML200

The A-WD-300 is a wafer dicing machine that is the world’s smallest 300 mm fully-automatic wafer dicing machine. It has substantially improved throughput with the installation of the twin-spindle and boasts a total accuracy of 4 µm. With its compact size and high precision, the A-WD-300 is a powerful tool for wafer dicing.

A-WD-300

Compatible with 200 / 150 / 100 mm size wafer.

ChaMP 232

ML300EX-FH

ML300

The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).

UF3000

The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.

UF200

The Accretech UF3000EX is a fully automatic wafer prober for the highest production requirements. It is now even quicker and more precise, with an extremely high throughput and highest probe power. It also has an optical measurement system and very precise navigation.

UF3000EX

The ACCRETECH / TSK UF200A is a probing machine used for wafer and CSP handling. It is a highly efficient, high throughput machine that offers better cost performance. It can perform transfer and testing on 5 to 8 inch wafers and has a variety of options for all kinds of wafer tests.

UF200A

The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.

UF3000EX-e

The A-WD-200T is the first twin-spindle dicer for 200mm wafers. The A-WD-200T is a wafer dicing machine that features a face-to-face, twin-spindle arrangement and X-axis acceleration for outstanding throughput. The machine is equipped with a linear motor in the X-axis mechanism that enhances dicing quality by minimizing vibration. The color LCD touch-panel operation screen is easy to understand and convenient to use. Additionally, the X-axis drive mechanism is now entirely contact- and maintenance-free, making it a reliable and efficient choice for wafer dicing operations.

A-WD-200T

The A-PM-90A Series is an 8-inch full-auto machine designed for high precision and high rigidity. It is specifically designed for memory and logic devices, which are becoming increasingly miniaturized and multi-pin. The machine features an automatic needle matching function, among other features, making it ideal for unmanned line construction. Additionally, the A-PM-90A Series boasts high throughput and cleanliness handling, ensuring efficient and reliable operation. 

A-PM-90A

ACCRETECH / TSK UF 200SA is a Probers system. The UF 200SA can produce wafer size of 8".

UF200SA

High-precision XYZ control system with minimum footprint and high throughput, Multiple operation mode(manual, semi-auto, lull-auto} 

UF60

The ACCRETECH / TSK UF3000LX is a probing machine that performs electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. It is a prober with high-speed probing that targets non-memory devices. High-speed and low-vibration are achieved by adopting the newly developed exclusive XY driving system. Compared with existing products, it has a smaller footprint due to design changes and has reduced power consumption by 10% in consideration for the environment.

UF3000LX

Wafer Dicing Machine - The full automatic wafer dicing machine with the face-to-face twin-spindles, ready for the 300 mm wafer.

A-WD 300T

The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.

UF2000

ACCRETECH / TSK UF200S is a probing machine used for electrical testing of each chip on a wafer, ensuring the quality of semiconductor devices.

UF200S

MHF300L

A-WD-300TX

Wafer probers are used in the semiconductor industry to test and measure electrical characteristics of integrated circuits (ICs) on wafers before they are packaged. The UF190B is typically used in research and development, quality control, and production testing of ICs.

UF190B

This prober is specially designed for general logic devices, not only inherits the basic concept of UF200, but also further adopts the latest architecture. It can perform transfer and probe testing of 5 to 8 inch wafers. Use the same MMI as the UF2000. Multiple options to achieve all non-industry standard types of wafer probes.

UF200R

Optimized spacing by utilizing all components and optional unit well within the compartment
Standard Spindles up to 60,000 rpm
(80,000 rpm as optional)
Enhanced throughput
①X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec
②Two Optical Cutter-Set units
③The Worlds’ smallest blade-to-blade distance
17” LCD touch panel and new GUI
GUI（Graphical User Interface)　with simple layout and large touch-buttons allow users’ interactive operation
Easy and simple Kerf check function
(AI kerf check function)
Over 10,000 recipes storable
USB port as standard
(USB memory device can be used as external memory)
Ease-of-maintenance
Wide maintenance door and front-side accessibility allows easy of routine maintenance
Optimized vacuum controller
Reduces 50% of air consumption compared with existing model

AD3000T

Stand-alone wafer cleaning unit, A-CS-1OOA will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
■ Maximum rotation speed of spinning table is up to 3,000 min-1
■ Available frame size: 5 to 8"
■ Cleaning method: High-pressure
Rinse Air dry (Driven by swing arm)

A-CS-100A

 UF300 is a state-of-the-art device that is ready for volume production of 300 mm lines. It is capable of producing large quantities of 300 mm lines, making it an ideal choice for high-volume manufacturing operations.

UF300

The A-WD-5000A is a high-speed, high-precision machine that boasts the world’s smallest size. It features a database of optimum machining conditions, a multi-function design that considers expandability, and an energy-saving design. This machine is designed to provide the best possible performance while minimizing its environmental impact.

A-WD-5000A	

U-FW-300B

The ACCRETECH / TSK UF200AL is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers improved precision and throughput. It also has a variety of options for all kinds of wafer tests that are not standard in the industry.

UF200AL

UF190R

The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.

A-WD-10A

A-WD-100A

A-WD-100M

The FP2000 is a probing machine made by ACCRETECH / TSK. It performs precision measurements using their unique correction technology on cut wafers, packages and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafers of 5 to 8 inches with only one click of a button.

FP2000

AP3000e

AD20S

HRG200X

UF3000EX-f

ML200Plus

Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.

PG300RM

A-WD-250S

WIN WIN 50

The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.

FP3000

PG200RM

Surface texture measuring instrument. Superior GUI achieve easy operability.
Flexible editing of analysis results.

SURFCOM 1400D

Most significant machine model for 200mm wafers High precision, high rigidity machine.

ACCRETECH / TSK

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HRG3000RMX

ACC300

MHF4000EX

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