Siemens AG (Berlin and Munich) is a global powerhouse in electronics and electrical engineering, operating in the industry, energy and healthcare sectors.

The Siplace TX2i is a high-end placement solution that sets new records in speed, floorspace performance, and accuracy for high-volume production applications. It can place up to 96,000 (benchmark rating) components per hour, including 0201 (metric) components at the highest speed. It also features a new SIPLACE Tray Unit and two stationary high-end camera systems, making it suitable as a space-saving end-of-line machine.

ASMPT / SIEMENS

SIPLACE TX2i

The ASMPT SIPLACE SX4 is an advanced and high-speed pick and place system that represents the pinnacle of performance within the SIPLACE SX platform. With its fourgantry design, the SX4 achieves exceptional production throughput, setting new benchmarks for performance per square meter, a crucial factor for investment considerations. This powerful machine delivers an impressive placement speed of up to 135,000 components per hour (cph) while occupying a compact footprint of only five square meters (1.90x2.65 m).

SIPLACE SX4

E BY SIPLACE

Primarily used as a high speed runner or as a fast and flexible end-of-line machine, depending on its head configuration. Siplace X4 has a modular structure, and can be perfectly adapted to meet all the requirements of electronics production. 

SIPLACE X4

The ASMPT SIPLACE SX1 is an advanced and versatile pick and place system designed to enhance the efficiency and accuracy of semiconductor manufacturing processes. With increased speed, accuracy, and flexibility, the SIPLACE SX1 offers a range of features that make it a smart and adaptable solution for the industry. It boasts a placement speed of 43,000 cph (components per hour) and a feeder capacity of 120 × 8-mm slots, ensuring fast and reliable production. The system supports a wide component spectrum from 0201 (metric) to 200 mm × 125 mm × 50 mm, accommodating various component sizes. Its board size capabilities range from 50 mm × 50 mm to 1,525 mm × 560 mm, allowing for production on different PCB sizes. The SIPLACE SX1 comes equipped with versatile placement heads, including SpeedStar (CP20P2), MultiStar (CPP), and TwinStar (TH), enabling it to handle diverse production requirements with ease.

SIPLACE SX1

The ASMPT SIPLACE SX2 is an advanced pick and place system equipped with high-speed production capabilities and increased accuracy and flexibility. This smart and open platform is designed to adapt quickly to various challenges, making it an ideal solution for semiconductor manufacturing. With a placement speed of 86,500 cph (components per hour) and a feeder capacity of 120 × 8-mm slots, it ensures efficient and reliable production processes. The SIPLACE SX2 supports a wide component spectrum from 0201 (metric) to 200 mm × 125 mm × 50 mm, enabling it to handle a diverse range of components. Its board size capabilities range from 50 mm × 50 mm to 1,525 mm × 560 mm, accommodating various PCB sizes. The system comes with different placement heads, including SpeedStar (CP20P2), MultiStar (CPP), and TwinStar (TH), ensuring versatility and adaptability for different production requirements.

SIPLACE SX2

SIPLACE S-25 HM

SIPLACE 80 S23 HM

The Siplace X4i S is a high-performance machine designed for high volume production. It features intelligent feeders and placement heads, advanced sensors, and a digital vision system for maximum precision and reliability. It can detect PCB warpage, has a speed of 146,000 cph (IPC rating), and can handle a wide range of component and board sizes. The machine is robust, reliable, and offers advanced capabilities for high volume production.

SIPLACE X4i S

SIPLACE S25

SIPLACE D2

SIPLACE HF/3

SIPLACE HS50

SIPLACE 80 S20 FS 02

SIPLACE F5 HM

SIPLACE X3

SIPLACE X4 S

SIPLACE A2

SIPLACE HS60

SIPLACE DX4

SIPLACE X2

SIPLACE SP 500

LOT OF FEEDERS

SIPLACE X3 S

SIPLACE DX1

 SIPLACE DX2

SIPLACE TX2

The SIPLACE D1 placement machine combines high flexibility and precision with an attractive price/performance ratio. Two placement methods are used: 
  *The Collect & Place method for fast placement of standard components 
  *The Pick&Place method for fast placement of special fine-pitch and super-fine pitch components

SIPLACE D1

SIPLACE A1

SIPLACE HS25

SIPLACE D1i

SIPLACE X2 S

The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.  

ASMPT / SIEMENS

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