The G4 ICARUS HF combustion analyzer is the ideal instrument for the rapid, precise and simultaneous determination of carbon
and sulfur in numerous material types, such as: steel, iron, cast iron, alloys, non-ferrous metals, aluminum, titanium and alloys, zirconium and alloys, ores, ceramics, cement, limestone, and many more. The G4 ICARUS HF is virtually maintenance free and easily operated via intuitive PC based software. The solid sample is combusted in a high-frequency furnace in a flow of oxygen.

BRUKER

G4 ICARUS HF

S8 TIGER

The MultiMode® platform's long history of success is based on its combination of superior resolution, performance, and unparalleled versatility and productivity. The MultiMode 8-HR atomic force microscope (AFM)  further advances these capabilities to provide significant improvements in imaging speed, resolution, and nanomechanical performance with higher speed PeakForce Tapping®, enhanced PeakForce QNM®, new FASTForce Volume, and exclusive Bruker probes technology.

MULTIMODE 8-HR AFM

ContourX-200

HYSITRON TI980

IFS 66/S

IFS 66v/S

High-end analyzer, designed for automatic and precise determination of O/N/H


G8 GALILEO

D8 ADVANCE Series II

MATRIX-F DUPLEX

The D2 CRYSOTM is the worldwide first and only benchtop device for a fast X-ray spectroscopic determination of the crystallographic orientation of single crystals applying a patented energy-dispersive method. In addition to the main orientation (surface orientation) the orientation of a second crystallographic direction (flat position, azimuthally orientation) can be determined without changing the position of the analyzed crystal. The measurement and analysis are performed fully automatically after the 
establishment of measurement directives. Thus, the D2 CRYSO is especially suitable for routine measurements connected to the crystal confectioning or the quality control. A process-oriented application of the benchtop system is possible. Crystals can be measured in form of wafers, plates or discs with at least one defined flat surface. The device concept and beam guide allows a simple handling of samples.

D2 CRYSO

AMAZON ETD

InfiniteFocusG5 plus

HYSITRON TS75	

S8 FABLINE - T

AXS D8

M4 TORNADO

AXS C79298-A3244-A4	

InSight AFP

TENSOR 27

MICROFLEX

TRIBOLAB CMP

NPFLEX

XFLASH-6T160

DEKTAK XTL

The VERTEX 70 provides the entry level of the Bruker VERTEX Series of high performance FT-IR spectrometers for demanding analytical and R&D application. The innovative instrument design results in PEAK flexibility and PEAK performance. The fully digital FT-IR spectrometer features DigiTectTM technology based on parallel running dual-channel delta sigma ADC´s with 24-bit dynamic range, the ACR and AAR Automatic Components and Accessories Recognition as well as the BRAIN Bruker Artificial Intelligence Network which guarantees PEAK signal-to-noise ratio and reliable user friendly instrument operation.

VERTEX 70

maXis plus

The system has been designed from top to bottom
to deliver the revolutionary low drift and low noise
that allows users to achieve artifact-free images in
minutes instead of hours. The Dimension Icon also is
now equipped with proprietary ScanAsyst® automatic
image optimization technology, which enables easier,
faster, and more consistent results, regardless of user
skill level. 

DIMENSION ICON

CONTOUR GT-X8

NANOSTAR

D2 PHASER

UVX210

The Bruker D8 DISCOVER is an advanced X-ray diffraction platform with a wide range of applications in high-performance materials research and methodology development. It incorporates state-of-the-art technology, including the unique ability to perform in-plane grazing incidence diffraction (IP-GID). The system serves as a versatile laboratory platform for developing new methodologies that can be seamlessly transferred to the D8 FABLINE tool, enabling smooth implementation in semiconductor fabs.

D8 DISCOVER

high performance digital nmr spectrometer

AVANCE 300

ALPHA II

AUTOFLEX SPEED

MAXIS IMPACT UHR-TOF

IFS 66v

SCION 456-GC

ContourGT

InSight 300

S2 PUMA

The VERTEX 80 and the VERTEX 80v vacuum FT-IR spectrometers are based on the actively aligned UltraScan™ interferometer, which provides PEAK spectral resolution. The precise linear air bearing scanner and PEAK quality optics guarantees the ultimate sensitivity and stability. The VERTEX 80v is an evacuated optics bench that can eliminate atmospheric moisture absorptions for ultimate sensitivity and stability; enabling demanding experiments such as high resolution, ultra fast rapidscan, step-scan, or UV spectral range measurements.

VERTEX 80v

DIMENSION V

AVANCE 400	

DIMENSION EDGE

ContourX-100

The DektakXT® stylus profilometer features a revolutionary benchtop design that enables an unmatched repeatability of 4Å and up to 40% improvement in scanning speeds. 

DEKTAK XT

The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.

D8 FABLINE

QUANTAX 200

S4 EXPLORER

ContourGT-X

Robust, high-efficiency, 27MHz plasma system with patented interlaced coils providing stable analysis for the toughest sample matrices     
High-efficiency 90 degree ion mirror delivering unmatched sensitivity at more than 1 million counts per second for 1µg/L     
All-digital extended range detector with more than nine decades of dynamic range in pulse counting (digital) mode allows the measurement of trace to major elements in a single analysis.     
Integrated laser abalation (LA) and liquid chromatography (LC) interfaces. Laser ablation allows for the direct analysis of solid samples while LC makes elemental and molecular speciation easy.     
A range of optional accessories to further expand the productivity and capabilities of your 800-MS. Including SPS3 autosampler for automated sample analysis, Productivity Pack increases sample throughput for laboratories with large sample numbers and Clean Room Pack eliminates instrument contamination in clean room facilities     
     
The 820-MS also features Bruker‘s novel collision reaction interface (CRI) system, which provides simple, routine removal of troublesome spectroscopic interferences. The result is faster, more flexible interference-free analysis without the worry of complex multipole or scanning quadrupole ion guides, or cells.

820MS	

DIMENSION 5000

INSIGHT 3DAFM

D4 ENDEAVOR

EACOPE

ContourSP

430-GC

EVOQ GC-TQ™ MS triple quadrupole systems provide analysts with a GC-MS platform especially designed for the Gas Chromatographer. The EVOQ GC-TQ Series sets a new industry standard for GC-MS. The EVOQ series is simple to use and incredibly sensitive and delivers robust and reliable performance. All this comes complete in a space-saving package that makes upgrading to new levels of performance a simple and cost-effective process.

EVOQ GC-TQ MS

DIMENSION 3100

RD-089	

About the footprint of a laboratory notebook, ALPHA is a very compact FT-IR spectrometer perfectly suited for the daily routine. Plug & play set-up, easy to use software, combined with QuickSnap™ sampling modules assure the powerful and reliable FT-IR analysis you expect from Bruker.

- Low-cost, small footprint FT-IR spectrometer
- Quality components with long lifetime
- Intuitive instrument and software design for maximum ease of use
- Flexibility: Easily exchangeable QuickSnap™ sampling modules for every analytical question
- Intelligence: Electronic coding of sampling modules and spectrometer components
- RockSolid: Robust, high performance results with Bruker's well-proven interferometer design

ALPHA

SCION 436-GC

The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).

FilmTek 2000M TSV

DIMENSION FASTSCAN

BRUKER

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