EBARA

A70W

A150W-T

A150W-M

A10S

150 X 40

A70WN	

AA40W

A30W

AA70W

This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

F-REX300

The Ebara FREX 300 S is a 300mm CMP system, featuring a four-head, four-platen design with a three-step clean process. It reliably meets 7nm tech requirements, providing development and production flexibility, and best-in-class reliability and cost of ownership.

F-REX300S

AA20

AAE40WN

AA200W

40 X 20

AA200WN

AA20N

Vacuum Dry Pump AA20N-H, 200V, 50/60 Hz, Corrosian Resist, Horizontal Outlet, with Exhaust Pressure Sensor

AA20N-H

80 X 25

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

F-REX200

A300W	

AA10

EPO 112

150X40 UERP6M

AA30

EPO 223

ET600H-US

50 X 20

AAS300WN

ESA70W

GDC 250 SA

AA10N	

AAS200WN

305W

EPO 222

AA40WN

EAC300BI-T

A25S

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0Pa

EV-S20P

UFP 300A

AA70W-H

ET-300W	

EPO 222T

A30W-C

ET-600	

Vacuum Dry Pump AA20-H, 200V, 50/60 Hz, Horizontal Outlet

AA20-H

Technical Characteristics:
-DC Motor
-Low Energy consumption
-Complete pump safeguard system
-High pump operating temperature preventing condensation
-Low noise and low vibration

AAL10

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.

F-REX300X

AA100W

ESR20N

GDS500SA	

AA70WN

150X40UERP6M-J

AA70WN-H

EMT2400MBWC	

50X20UERR6M

ET1600WS

A30W N

ESR200WN

Vacuum Dry Pump A07V-B, 200V, 50/60 Hz, Basic Version

A07V-B

A07V

150X40 UERP6M-U

EPO-222D

GDS250SA

ESA25-D

ESDP 30	

EPO 2228

AA40WV1-H

CS-22

AAS100WN

The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements. 

F-REX300SII

UERR6M 50X20 

Dry (oil free) vacuum pumps
Pumping Speed (60 Hz): 20,000 l/min

EST200WN

EV-M502NS

The Model EV-M302N dry vacuum pumps are designed for high-load applications where large volumes of reaction byproducts are generated. Its outstanding power consumption performance and enhanced corrosion resistance, as a standard, support a broad range of industry applications.           

Options:
-Various Booster & Exhaust Thermal Configurations (Process Dependent)
-ESD Resistance
-Idle Mode (Green Energy Mode)
-Hardware: Seismic Brackets
-Pump Systems – Integrated Rack Solutions
-Pump Installation Lifts
-Reusable Shipping Crates

EV-M302N

The ESA70W dry vacuum pump by Ebara is designed for light-gas applications like MOCVD. It offers options like dual voltage, alternate exhaust configurations, NiResist cast material, idle mode, seismic brackets, integrated rack solutions, installation lifts, and reusable shipping crates. It's perfect for medium to light-duty processes, hydrogen handling, large load-lock applications, and as a replacement for the A Series EBARA Model A70W pump.

ESA70W-D

UFP 200 / 300M

A150W

AA10NV1-H

AA100W-H

ESR100-CN

EV-A06-3

EBARA's F-REX CMP system offers nanometer-level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing. Models F-REX200M2 and F-REX300X achieve advanced process performance and high productivity. The unique "1-head per 1-table" architecture delicately processes individual wafers, while the "4 table platform" ensures high throughput.

EBARA

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