EBARA

JSM-6320

The Model EV-M302N dry vacuum pumps are designed for high-load applications where large volumes of reaction byproducts are generated. Its outstanding power consumption performance and enhanced corrosion resistance, as a standard, support a broad range of industry applications.           

Options:
-Various Booster & Exhaust Thermal Configurations (Process Dependent)
-ESD Resistance
-Idle Mode (Green Energy Mode)
-Hardware: Seismic Brackets
-Pump Systems – Integrated Rack Solutions
-Pump Installation Lifts
-Reusable Shipping Crates

EV-M302N

EBARA's F-REX CMP system offers nanometer-level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing. Models F-REX200M2 and F-REX300X achieve advanced process performance and high productivity. The unique "1-head per 1-table" architecture delicately processes individual wafers, while the "4 table platform" ensures high throughput.

F-REX200M2

AA10Nv1	

AA70WV1-H

Dry Pump
Pumping Speed (60 Hz): 20,000 l/min

EV-S200P

A300W	

AA70WNV1-H

EV-M502NF

Dry (oil free) vacuum pumps
Pumping Speed (60 Hz): 30,000 l/min

EST500WN

AA10NV1-H

150X40UERP6M-J

Dry Pump
Pumping Speed (60 Hz): 30,000 l/min


ESA300W

EV-A10-2

The ESA70W dry vacuum pump by Ebara is designed for light-gas applications like MOCVD. It offers options like dual voltage, alternate exhaust configurations, NiResist cast material, idle mode, seismic brackets, integrated rack solutions, installation lifts, and reusable shipping crates. It's perfect for medium to light-duty processes, hydrogen handling, large load-lock applications, and as a replacement for the A Series EBARA Model A70W pump.

ESA70W-D

AAS20N

UFP 200/300A

150X40 UERP6M-U

EV-A03-1

EPO-2226D

A40W

AA100V1 H

EV-A06-3

AA100W-H

A200W

AA10V1

EPO 213

40X20ERD5M-NJ

AA40WNV1-E

Typical applications for the Model ESR80W dry vacuum pump include load locks, SEM, Etch, CVD, PVD, Ashing and Ion Implant processes that require the best vacuum performance and optimum uptime.
Pumping Speed (60 Hz): 4,000~8,500 l/min

ESR80W

IQDP 40

ESR201W

ET300WS	

AA30W

40X20ERD5M

UFP-100/150A

80x25UERR6M	

A500W-T	

50X20UERR6M

EV-M102N	

UERR6M 50X20 

306W	

EV-M502NS

A30W N

40×20 ERD5M-N

ESR100WN

UFP 200 / 300M

MS-96770-1T/011126401

**PARTS**

A30W-C

EPOS-010

ESR100-CN

EV-S20

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0 Pa

EV-S20N

A10S

AA40W

A150W-M

A150W-T

ESA25-D

The Ebara FREX 300 S is a 300mm CMP system, featuring a four-head, four-platen design with a three-step clean process. It reliably meets 7nm tech requirements, providing development and production flexibility, and best-in-class reliability and cost of ownership.

F-REX300S

AA70W

This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

F-REX300

A30W

150 X 40

AAE40WN

AA200W

AA200WN

80 X 25

40 X 20

EAC300BI-T

AA10

AA30

A70W

GDC 250 SA

AA70WN

AA40WN

AA10N	

EPO 2228

Dry (oil free) vacuum pumps
Pumping Speed (60 Hz): 20,000 l/min

EST200WN

EPO 112

50 X 20

ESA70W

EPO 222

ET600H-US

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

F-REX200

150X40 UERP6M

AAS200WN

A70WN	

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0Pa

EV-S20P

Dry (oil free) vacuum pumps 
Pumping Speed (60 Hz): 30,000 l/min

EST300WN

EPO 113

Technical Characteristics:
-DC Motor
-Low Energy consumption
-Complete pump safeguard system
-High pump operating temperature preventing condensation
-Low noise and low vibration

AAL10

EAC300bi-hv

305W

The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements. 

F-REX300SII

AAS300WN

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.

F-REX300X

ESR80WN

ESR20N

ET-600	

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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F-REX200M2

AA10Nv1

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