BESI acquired Laurier in 2002.
BE Semiconductor develops, manufactures, markets, sells, and services semiconductor assembly equipment. Laurier manufactures die sorting pick-and-place equipment for companies.

The LAURIER DS-9000 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate

BESI / LAURIER

DS-9000

DS-11000

DS-7000 T/R

CP-222

SA-202

DS-7000

DS-6000

DS-7000S

DS-7000 SPEEDSTAR

DS-3000

The Laurier DS-4000 is a highly precise and versatile die sorter designed to handle a wide range of devices, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. With its advanced capabilities, the DS-4000 offers the flexibility needed to accommodate different types of devices, providing efficient and accurate die placement.

DS-4000

HA-250

DS-4000 SPEEDSTAR

BESI / LAURIER

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