Nordson acquired Dage in 2006


https://www.nordson.com/en/divisions/dage/about/profile

NORDSON / DAGE

MCT 20

MF 22U

5000 PXY	

2400 PC

4000 TPAXY

100GB

XD7500NT

MICROTESTER  22

QUADRA 7

XD 6600

4000 XY

XD800NT RUBY XL

4800

MF 22A

2400

BT 2400

Quadra 3

PCI2

5000P

XL 6500

BS 500

BT 4000

QUADRA 5

BT 28

4000 TP

4000-HK-5-2

The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull tester or upgraded for ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests. The 4000 bondtester uses patented frictionless load cartridges and air bearing technologies to ensure maximum accuracy, repeatability and reproducibility. Cartridges for different applications are readily exchanged. Many functions are automated with sophisticated electronic and software controls.

4000

4000PXY

2400PC-WP10KG

5000

BT 23

Achieving the best X-ray image quality for current and future needs within the PCB electronics industry.

XD7500VR

2400A

2400-WP-100

XD7600

XD6500

The Dage’s XD7500 XiDAT X-ray system is a high-resolution X-ray inspection system that provides high resolution, high magnification and high contrast X-ray images at the largest and different angular views. It has Dage Version 11 “Image Wizard” software, < 2-micron feature recognition, automated inspection, video capture and the most user-friendly operating system on the market.

XD7500

MCT 22

The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.

The 4000Plus multi-purpose bondtester performs shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and micro materials tests. This system is also ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.

4000P

The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both shear and pull modes with speeds up to 4m/sec for shear and 1.3m/s for pull. The 4000HS bondtester also offers advanced analysis options, specifically force versus displacement graphs and energy measurements in addition to the conventional peak force measurement.

4000HS

The Dage XD7600NT is an X-ray inspection system that provides oblique angle viewing of up to 70-degrees for any position 360-degrees around any point of the entire 18” x 16” (458 x 407 mm) inspection area allowing the XD7600NT to inspect all interconnections and PCBs containing BGA and CSP devices. It has a standard 2.0 mega pixel imaging system and can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints.

XD7600NT

The Nordson DAGE 4000 has been specifically designed to be ergonomically adjustable for operators, thus helping to overcome problems associated with Repetitive Strain Injury (RSI). Particular attention has been given to working heights,
optics eyeline, arm rests and the position of controls.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

NORDSON / DAGE

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