STS provides advanced wafer processing solutions to the world's leading semiconductor and microelectronic device manufacturers. 

The STS MULTIPLEX ICP is an etch system. The STS MULTIPLEX ICP can be used with 2” wafer sizes. It has a silicon material plate and ASE polymer system processer. 

MULTIPLEX ICP

STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.

MULTIPLEX

MESC MULTIPLEX AOE 

PRO ICP 

310/320 PC

320 PC

CPX Pegasus 

With market leading etch rates using a conventional de-coupled plasma source, the HRM provides a cost effective Deep Reactive lon Etch (DRIE) processing chamber. Designed to offer high etch rates while controlling ion damage, the HRM is ideal for deep anisotropic silicon etching using STS' ASE® process technology.

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