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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS EXPIDA 1255S
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    OEM 型号描述
    The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.
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    THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

    EXPIDA 1255S

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    已验证

    类别
    Analytical

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    37941


    晶圆尺寸:

    未知


    年份:

    未知

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    THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

    EXPIDA 1255S

    verified-listing-icon
    已验证
    类别
    Analytical
    上次验证: 60 多天前
    listing-photo-2ba6b9c713e645c0b51058c664d98db4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    37941


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.
    文件

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