概述

Visual inspection equipment for mounting boards (AOI) Automatic microelectronics inspection machine ・ Offline software ・ SPC software ・ Sample distortion correction ・ Double camera (1.7 um (2X) or 0.34 um (10X)) ・ 3D sensor ・ Dual lane conveyor ・ SPC data collection and reporting ・ 4.0 and SECS / GEM compatible · High speed measurement system · Bonding wire inspection (2D or 3D) · High resolution 2D and 3D sensors · 1 μm pixel size for 2D · 7 μm for 3D applications · Linear drive drive · High speed high precision with submicron encoders · 3D and high Z-axis with resolution autofocus