说明
Automated Debonding System配置
无配置OEM 型号描述
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.文件
无文件
EVGroup (EVG)
EVG850 DB
已验证
类别
Bonder/Debonder
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106473
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 DB
类别
Bonder/Debonder
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106473
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Automated Debonding System配置
无配置OEM 型号描述
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.文件
无文件