SYNAPSE S
概述
Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Original wafer bonder, built on the Lithius frame.
活动的上架物品
0
服务
检验、保险、评估、物流
热门上架物品
- 未找到产品
Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Original wafer bonder, built on the Lithius frame.
0
检验、保险、评估、物流