The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



TWIN EAGLE 60

类别

概述

活动的上架物品

服务

热门上架物品

使用 Moov 上架，立即找到完美买家。