概述

Member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The Esec 2100 sD advanced Die bonder is able to handle the most challenging thin die and warped strip packages. the proven "light & rigid" structure of the pick and place ensures highest accuracy and maximized throughput.