Datacon Technology is a manufacturer of flip chip bonding, multichip die bonding and other related assembly equipment.

The PPS 2200 series die bonder offers totally modular hardware and software for multichip applications. Four types of nodes are capable of managing pneumatic cylinders, DC motors, step motors, and even the proprietary image processing system.

BESI / DATACON

PPS 2200

The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications.

8800 TC advanced

8800 FC QUANTUM sigma

8800 FC QUANTUM advanced

8800 FC QUANTUM plus

The Datacon 8800 TC is a bonding equipment that utilizes Thermo Compression (TC) technology, which is a crucial technology for current 2.5D/3D chip-to-substrate (C2S) and chip-to-wafer (C2W) packaging applications. Thermo Compression with CUF (Chip-to-Uneven-Flag) is a well-established process used in 3D memory applications.


8800 TC

Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield.
- Versatile High Speed Flip Chip Bonder
- Unique Quattro Concept
- Accuracy ± 4μm @ 3σ
- UPH up to 16,000

8800 FC QUANTUM hs

The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. 

8800 FC QUANTUM

The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).

8800 CHAMEO

The Datacon PPS 2210 is a multi-chip die bonder used for attaching chips to a substrate.

PPS 2210

As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.
The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs

BESI / DATACON

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热门 BESI / DATACON Bonders

8800 TC advanced

8800 FC QUANTUM hs

PPS 2200

8800 TC

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