Known for its high level of automation and reliability, the EVG620 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVG620 BA

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