Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™.
The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds.
Bond Force Control System with Piezo Sensor Technology
Advanced Low Friction Wire Feed System
Fully Programmable BITS System
Latest PC-based Processing Power
Small Ball Detection
Maxµm ultra Enhanced Performance
UPH +10% over the Maxµm plus
±2.5µm Accuracy for 35µm Pitch Production
Copper Wire Bonding Capable

KULICKE & SOFFA (K&S)

Maxµm Ultra

The ps(Power Series) IConnPS ball bonder, which replaced the Maxum Ultra ball bonder and improves IC inter-connect performance with expanded technology that addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

IConn

The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect:
 UPH 10% greater than the Maxµm on most applications
 + 2.5 µm accuracy at 3 sigma
 35 µm ultra-fine-pitch process capability
This yield-enhancing accessory consists of the following...
 Innovative Moving EFO Wand Technology
 Electronic Flame-Off from directly below the wire axis
 Specially designed, Fine-tipped EFO Wand and 8X Mag Optics
...resulting in these benefits:
 Improved Free Air Ball and Bonded Ball Concentricity
 Reduced "Small Ball" occurrence
 Better intermetalic coverage and higher bond strength
 Greater yield for ultra-fine-pitch processes 
A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.

Maxµm Plus

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID

IConn MEM PLUS ELA

8060

Fully automatic wire bonder. 
± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kit

IConn PLUS

The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.

8028

The Maxum Elite to supersede the Nutek it provides approximately a 10% productivity improvement over its predecessor and offers various other performance improvements.

Maxµm Elite

4123

8028 PPS

1488 PLUS

 ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space

ConnX LED

ConnXPS ball bonder replaced our Maxum Elite ball bonder. The ConnXPS is engineered to provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

ConnX

MAXUM	

4124

Model 1488 Turbo automatic gold ball wire bonder.

1488 TURBO

1471

4526

Advanced copper wire applications demanding high productivity.

IConn ProCu

8020

Automatic ball bonders which provide up to 20% more productivity than the Model 8028-PPS ball bonder and supports 45 micron production-level process capability.

Maxµm

6496

4524

The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.

AT PREMIER

6495

ULTRALUX AUTOMATIC WIRE BONDER is the latest generation ball bonder utilizing  the latest technologies and materials that will save LED manufacturers up to 10% capital cost. 

ULTRALUX

Ball bonder, high-end copper wire applications demanding advanced process capability and high productivity.

IConn ProCu PLUS

4522

4524AD

Ball bonder, large area substrate and matrix applications for copper wire.

IConn ProCu PLUS LA

1474fp

6497

4129

8098

4523

1488L TURBO

IConnPS PLUSTM LA (Large Area) is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.

The IConn PLUS LA (Large Area) is designed to meet all leading edge wire bonding challenges. It has an extended bondable area to 87 mm, which is becoming an industry standard strip format.

IConn LA

The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in  chip-on-board  (COB),  multi-chip modules  (MCMs) and similar  devices.

8090

4523AD

1419

1478

Wedge bonder, power hybrid and automotive modules with extended area using heavy and thin aluminum.

ASTERION 

The Model 1472 automatic aluminum wedge bonder and a series of manual ball and wedge bonders.

1472

1470

Wedge bonder, extended area for battery bonding and dual lane hybrid module bonding.

ASTERION EV

1470-4

1484

4700

ELITE

DEDICATED WEDGE BONDER FOR SINGLE-ROW TO PACKAGE. Power-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusion and Asterion platforms. In addition, expanded pattern recognition capabilities deliver industry leading productivity and reliability. 

POWER-C

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID MEM

8028S

IConn ProCu LA

Wafer level bumping for area array applications.

WaferPRO Plus

4127

RAPID ELA

Automatic wire bonder designed for low lead applications, a segment of the market we had not previously targeted.

Nu-Tek

1488XQ

1484XQ PLUS

Ball bonder, extended large area substrate and matrix applications for copper wire.

IConn ProCu PLUS ELA

ConnX LED PLUS

8028 PLUS

ConnX ELITE Opto ELA (Extended Large Area)

ConnX ELITE Opto ELA

4206

Ball bonder, large area substrate and matrix applications.

IConn PLUS LA

IBOND 5000

Ball bonder, cost performance extended large area substrate and matrix applications.

ConnX PLUS ELA

PowerFusion HLx can handle extra-wide matrix and IPM leadframes up to 105 mm wide. The HLx Model has all the capabilities of the HL Model with the added benefit of handling leadframes up to 105 mm wide. Whether you have a current requirement for wide leadframe processing or just want to invest in a flexible platform for future leadframe development, the HLx Model is the best choice for many applications.

PowerFusion HLx

8028L PPS

The PowerRibbon is a leading-edge interconnect for power packages, and is continuing to gain market acceptance. Further extension of our PowerRibbon® range towards both larger and smaller sizes.

PowerRibbon

Model 6900, an automatic multi-process assembly system which can be configured to support either conventional die bonding applications or alternate semiconductor assembly technologies. 

6900

Wedge bonder, smaller power packages using either aluminum wire or PowerRibbon.

PowerFusion HL

ConnX ELITE Opto LA

XENON

Wedge bonder, power semiconductors using either aluminum wire or PowerRibbon

PowerFusion TL

Ball bonders, cost performance large area substrate and matrix applications.

ConnX PLUS LA

POWERFUSION

The Model 8070, a bonder designed  specifically  for the assembly of micro-BGA.

8070

"""High productivity bonder for low-to-medium pin count applications.""
ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity:
Interactive Programmable Look Ahead Vision to ease first time set-up
Power Series Xpress Loop to help increase the productivity of short wire applications
Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices
Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area
10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder."""

ConnX PLUS

AUTOMATIC HIGH SPEED WIRE BONDER. ConnX ELITE is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE is the new standard in interconnection for Discrete and Low Pin Count packages.

ConnX ELITE

AUTOMATIC HIGH SPEED WIRE BONDER. ConnX ELITE Opto is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick-LED Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE Opto is the new standard in interconnection for LED packages.

ConnX ELITE Opto

Ball bonder, extended large area substrate and matrix applications.

IConn PLUS ELA

Ball bonder, advanced wafer level bonding applications.

AT PREMIER PLUS

8028 SG

4122

The ConnXPS LED PLUS is faster and now has a larger bondable area, with 80mm width as standard, with an optional kit to upgrade to 87mm with the ConnX LED PLUS LA.

ConnX LED PLUS LA

5408

8028 WG

1488 TURBO+

ConnX ELITE ELA

The Models 1484XQ and 1484LXQ automatic gold ball wire bonders.

1484XQ

FIRST K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications

KULICKE & SOFFA (K&S)

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Maxµm Ultra

IConn

Maxµm Plus

RAPID

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