概述

"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable