ABC200
类别
Bonders概述
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
活动的上架物品
5
服务
检验、保险、评估、物流
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
5
检验、保险、评估、物流