Universal Temporary Wafer Bonder for High Volume Manufacturing
SUSS MicroTec‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

XBS300

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