说明
无说明配置
Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.OEM 型号描述
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文件
无文件
NEWPORT
MRSI 605
已验证
类别
Bonders
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
23191
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
NEWPORT
MRSI 605
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
23191
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.OEM 型号描述
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.文件
无文件