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说明
无说明配置
无配置OEM 型号描述
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.文件
无文件
DISCO
DFP8141
类别
CMP
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112290
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.文件
无文件