概述

The HPM-43000 is a high-precision substrate coining machine designed for flattening C4 bumps on electronic substrates. It operates by extracting individual substrates from a tray, positioning them with a specialized jig, and then pressing them one at a time using four independent upper and lower heads. This process ensures high accuracy in flattening the C4 bumps. Its operation using computer control for positioning and executing specific tasks fits the broader definition of CNC technology.