SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

The actively chilled, recipe-based cool plate offers a closed cooling chamber preventing contamination on the wafer.
Manual system up to 200 mm.

SUSS MicroTec / KARL SUSS

GAMMA 60

Delta 80 RC

Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
SUSS MicroTec‘s LabSpin platform represents the next generation of manual spin coater and developer systems that have been developed specifically for laboratory and R&D. Designed for a variety of photolithography chemicals, LabSpin systems provide uniform, precise and repeatable spin coating results on the wafer through its advanced process chamber design.

LABSPIN6

Resist Coat and Develop Platform
The RCD8 semi-automated coater and developer platform is an outstanding tool for R&D and small-scale production and can be custom configured for each application.

The design of the RCD8 semi-automated coater and developer platform draws on SUSS MicroTec's expertise in large-scale production. It is built using the same high-quality components as SUSS MicroTec's full production assemblies. As such, the RCD8 coater and developer platform delivers top application quality with maximum reliability and repeat accuracy. Application-specific substrate chucks allow for the processing of various substrate materials and shapes. These range from square substrates measuring up to 150 x 150 mm and standard wafers up to 200 mm to special shapes up to a maximum size of 200 mm.

RCD8

Automated Coaters and Developers
The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.

ACS300 Gen3

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

ACS300 Gen2

Manual Spray Coater for High Topographies
SUSS MicroTec AS8/AS12 is the ideal tool for R&D and low-volume fabrication. Substrates up to 200 mm or 300 mm in diameter and square substrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.

AS12

DELTA 12AQ

DELTA ALTASPRAY

LabSpin8 is suitable for round substrates up to 200 mm diameter or square substrates up to 150x150 mm. With a wide range of substrate holders, even fragments and special shapes can be processed without any problems.

LABSPIN8

SUSS MicroTec's manual hot plate HP8 has been developed specifically to meet the requirements of R&D work and small scale production. The 200 mm hot plate (HP8) offers homogeneous temperature distribution as well as heating ramps with high repeating accuracy to ensure constant and stable process results.

ACS300 Plus

RC8 ST

Solvent Processes + Puddle / Spray   Development + Lift-off + Wafer Cleaning + Resist Stripping
up to 300 mm

DELTA 12L

DELTA12 RC

SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems.

ALTASPRAY

The vapor primer prepares the wafer surface to improve the surface condition for optimal resist adhesion.
Manual system up to 200 mm.

The KARL SUSS ACS 200 is a fully automatic coater/developer system for 200mm wafers. KARL SUSS ACS 200 include HVM and R&D in Advanced Packaging, MEMS and LED. Now on its 3rd generation, the KARL SUSS ACS 200 has the highest process module count of any 200 mm coater / developer on the market.

Automated equipment insures that all process steps are completed in a systematic, reproducible manner without variation inherent with manual operations. The Suss system may be configured with two or more coating systems, up to six hot plate units and an aqueous developer system. Substrates of many sizes, shapes may be processed simultaneously through any desired series of process steps or recipe.

ACS200

Priming + Spin Coating + Spray Coating + Baking + Development
up to 200 mm 

GAMMA

GAMMA 80

ACS300

RC8 MS3

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

ACS200 Gen3

"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging.

With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units.

The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."

ACS200 Plus

FALCON

DELTA 80T	

 Priming + Spin Coating + Puddle Development + Baking
up to 200mm

DELTA80

The Labcluster for Laboratories, Start-Ups, and Small Production
SUSS MicroTec’s Manual Coating System (MSC8) offers the latest generation of coating and aqueous developing techniques in a unique cluster configuration. It is designed and assembled to provide the greatest variety of functionalities on the smallest cleanroom footprint. Technologies which have proven themselves in SUSS MicroTec high-volume production tools are thus accessible to laboratories, start-ups, and small-scale production through the MCS8.

MCS8

DELTA 20T

Voltage: 400 VAC / 50 Hz / 16 A
Compressed air: 5 - 6 bar / tube OD 8 mm
Vacuum: min. - 0.7 bar / tube OD 8 mm
Nitrogen: 4.5 bar / tube OD 8 mm
Exhaust: OD 100 mm (3x)

DELTA 80 T2

RC8 THP

SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

SUSS MicroTec / KARL SUSS

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GAMMA 60

Delta 80 RC

LABSPIN6

RCD8

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