RF3T
概述
The RF3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60% higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical consumption, the largest contributor to track operating cost. Combined, these features provide lower CoO and higher process performance for lithography applications.
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