AMP 3300 PLASMA DEPOSITION SYSTEMS
Superior film qualities, both nitride and oxide, guaranteed uniformities, and proven reliability have made the AMP 3300 popular for a wide range of plasma passivation and interlayer applications. Recent process developments have led to an improved method of gas distribution employing a perforated electrode. This provides for uniform gas composition across the entire wafer platen, resulting in consistent film characteristics on every wafer.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

AMP 3300

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