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说明
无说明配置
无配置OEM 型号描述
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.文件
无文件
PREFERRED
SELLER
类别
CVD
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120206
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
APPLIED MATERIALS (AMAT)
CENTURA ULTIMA TE
类别
CVD
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120206
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.文件
无文件