Lam Research's ALTUS family is a suite of semiconductor processing equipment designed for advanced thin-film metallization (contacts, vias, plugs, 3D NAND wordlines, and interconnects).

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Altus

Lam introduced its DSM 9900 HDP CVD system in November 1995. DSM 9900 represents the next generation in HDP CVD technology first introduced in the Epic system with the DSM 9900 having a smaller footprint, high reliability and improved throughput. The DSM 9900 is well suited for the demanding requirements of high production environments. Like the Epic, the DSM 9900 makes use of electron cyclotron resonance (ECR) technology to form a high density, low pressure plasma. ECR enables remote plasma coupling that minimizes particulate contamination and maximizes throughput while filling gaps as small as 0.18 microns with aspect ratios as high as 3:1. The intermetal dielectric films created by simultaneously depositing and etching are planarized more easily, by chemical mechanical polishing, than films that are repeatedly deposited and etched by conventional techniques. The DSM 9900 technology, available on Lam's Alliance platform, has been installed at several customer sites and is being qualified for production of quarter- and sub-quarter-micron logic, microprocessor, and memory integrated circuits.

DSM 9900

DSM 9800 LP CVD system for depositing advanced pre-metal dielectric films. This system utilizes a patented integrated process design  for flowing gases rapidly over the wafer, forming films that are highly  uniform and planar at a lower thermal budget to provide improved device performance.  DSM 9800 has been installed worldwide and is currently being used for production of semiconductor devices at 0.35 micron and beyond.

DSM 9800

Lam introduced its Epic high density plasma (HDP) CVD system in July 1993. The Epic system incorporates electron cyclotron resonance (ECR) technology to form a  high-density, low-pressure plasma.  Its ability to  deposit and  etch simultaneously an intermetal dielectric film enables it to fill gaps as small as 0.35  micron and  below and to  generate a  film that is  easily planarized. The resulting film exhibits superior electrical qualities and significantly  reduces the  need  for additional  chemical mechanical  polishing.

EPIC

Integrity is  a low  pressure (LP)  CVD system  for  depositing advanced interlevel dielectric films. This system utilizes a patented integrated process  design for flowing gases rapidly over the wafer, forming films that are highly uniform and planar to provide improved electrical performance.  Integrity has  been installed at  several customer sites  and is currently  being used for production of semiconductor devices and in device development programs.

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