概述

The Applied SEMVision G7 system offers greater imaging variety and advances in automatic defect classification (ADC) based on expanded machine learning capabilities. Besides the imaging capabilities of the previous SEMVision generation, the new system offers unique imaging of the wafer-edge bevel and apex where undetected defects can reduce device yield. To achieve robust review of unpatterned wafers, an enhanced light source and collection mechanism combined with improved noise suppression enable optical detection of defects as small as 18nm.