概述

Inline vision equipment for testing defects in lead frame chips and wires in ring frames loaded into cassettes. 2D Vision Inspection -Rotation, movement, crack inspection after chip bonding -Bending, breaking, short inspection after wire bonding Compact Design -1684(W) x 1800(D) x 1764(H) -25 Megapixel Camera -4.5μm Telecentric Lens -8 Layers Light (UV)