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WI-2250

概述

The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.

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