说明
Film Thickness Measurement System配置
无配置OEM 型号描述
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.文件
无文件
KLA
SPECTRAFX 100
已验证
类别
Defect Inspection
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106455
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
SPECTRAFX 100
类别
Defect Inspection
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106455
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Film Thickness Measurement System配置
无配置OEM 型号描述
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.文件
无文件