概述

The 2360 High-Resolution Imaging Inspection System uses UV illumination and high numerical aperture to deliver superior resolution and material contrast for inspection of all process layers. It accelerates time to classified results and improves yield with Inline Automatic Defect Classification (iADC) and is compliant with SEMI 300-mm automation standards. It is ideal for new technologies in advanced 200-mm and 300-mm fabs, with particular effectiveness for critical etch, critical CMP, photo, and engineering analysis. It is part of the industry’s only comprehensive defect inspection system that addresses all stages of semiconductor manufacturing, from development through production.