Installed & Operational.
Brightfield Wafer Defect Inspection System

This 2365 system has many upgrades, so as the performance is almost the same as 2367 model.

-Dual Open 200 mm wafer cassette loading

-The 2365 UV/visible brightfield inspection system will allow you to see many types of yield-relevant defects down to the 65nm level.
Throughput is much improved, so you can sample more defects which occur during production.
Data rate is increased by 2x over previous generation brightfield tools.
Low false defects and automatic defect classification algorithms reduce time for SEM review and so allow you to do corrective actions quicker.
Buy doing a UV/DUV mix-and-match strategy with another 28xx inspection system maximises efficiency.
Connects with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
Process Window Qualification application enables detection of systematic defects

KLA 2365.pdf

KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

The KLA / TENCOR 2365 is a high resolution imaging system that can be used in 200mm and 300mm fabs. Applications include ritical etch, critical CMP, photo, and engineering analysis. It is particularly ideal for EOL metal etch and copper CMP layers. The KLA/TENCOR 2365 prober uses UV and visible light source and 0.12-mm pixel size for improved inspection sensitivity for 65-nm node and below design rules.

In 2004, KLA introduced our latest generation ultraviolet (“UV”)-based high-resolution imaging inspection system, the 2365, which incorporates multiple-bandwidth brightfield illumination and other enhancements to extend the performance of the 2xxx series to the 90-nm node and below.

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2365

Defect Inspection

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