说明
无说明配置
无配置OEM 型号描述
The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.文件
无文件
类别
Defect Inspection
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128169
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
SURFSCAN SP3
类别
Defect Inspection
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128169
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.文件
无文件