概述

The latest generation 8935 inspector employs new optical technologies and DesignWise® and FlexPoint™ precise area inspection techniques to capture critical defects that can cause chip failures. DefectWise® AI technology enables fast, inline separation of defect types for improved defect discovery and binning. With these innovations, the 8935 supports high productivity capture of yield and reliability-related defects at a low nuisance rate, helping both leading-edge and legacy node fabs accelerate delivery of their products—reliably and at lower cost.