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RUDOLPH / RVSI WS-3880
    说明
    无说明
    配置
    Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect review
    OEM 型号描述
    未提供
    文件

    无文件

    RUDOLPH / RVSI

    WS-3880

    verified-listing-icon

    已验证

    类别

    Defect Inspection
    上次验证: 60 多天前
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    19724


    晶圆尺寸:

    未知


    年份:

    未知

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    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSIWS-3880Defect Inspection
    年份: 0状况: 二手
    上次验证5 天前

    RUDOLPH / RVSI

    WS-3880

    verified-listing-icon

    已验证

    类别

    Defect Inspection
    上次验证: 60 多天前
    listing-photo-ogWWaqpLAMANqK61Ch1LhYSc78JOimUaIK7f4mz8GRo-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    19724


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect review
    OEM 型号描述
    未提供
    文件

    无文件

    类似上架物品
    查看全部
    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSI
    WS-3880
    Defect Inspection年份: 0状况: 二手上次验证: 5 天前
    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSI
    WS-3880
    Defect Inspection年份: 0状况: 二手上次验证: 60 多天前