Veeco Instruments Inc. a global leader of advanced thin film etch and deposition process equipment, acquired Ultratech, Inc. a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs.


Superfast 4G+ in-line, 3D topography inspection system for the optical-based inspection of advanced 3D memory and logic devices. Based on patented coherent gradient sensing (CGS) technology, this system provides the industry’s highest productivity, with throughput at 150 wafers per hour, and lowest cost of ownership. Generating up to 3 million points of data per wafer, Superfast 4G+ is able to fully map a wafer out to its edge. 

VEECO / ULTRATECH

SUPERFAST 4G+

Superfast 4G system can be upgraded to a Superfast 4G+.

SUPERFAST 4G

Wafer Inspection Systems
The Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield. At advanced technology nodes, variations in stress and distortion on a wafer can have a significant impact on device performance and yield. Based on CGS technology, we believe that our Superfast 3G provides the industry's highest wafer resolution for the targeted applications and measures over 800,000 points of data per 300mm wafer. The Superfast 3G is unique in that it collects data from the whole wafer simultaneously, providing significantly higher data density without the need for targets or pads.

VEECO / ULTRATECH

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热门 VEECO / ULTRATECH Defect Inspection

SUPERFAST 4G+

SUPERFAST 4G

SUPERFAST 3G

使用 Moov 上架，立即找到完美买家。

全部 VEECO / ULTRATECH Defect Inspection