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市场 > Deposition > APPLIED MATERIALS (AMAT) > ENDURA iFILL Al CVD/PVD

ENDURA iFILL Al CVD/PVD

概述

Aluminum Deposition — Aluminum (Al) continues to be the material used by many memory manufacturers for interconnects. The Applied Endura iFill Al CVD CVD/PVD system is used for building high-density interconnects in Flash and DRAM memory chips. This advanced process, for sub-90nm generations, enables customers to replace tungsten structures with aluminum to achieve faster chips with fewer steps and less cost.

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