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市场 > Deposition > LAM RESEARCH / NOVELLUS > INOVA NExT HCM IONX

INOVA NExT HCM IONX

概述

The latest variant of the INOVA platform, introduced in 2007, incorporates a copper resputtering technology called HCM IONX to improve copper seed conformality, eliminate low-k dielectric damage, and extend PVD technology for seed deposition applications at 32 nm.

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