说明
PVD配置
PVDOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
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LAM RESEARCH / NOVELLUS
INOVA
已验证
类别
Deposition
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17285
晶圆尺寸：
8"/200mm
年份：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
INOVA
类别
Deposition
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17285
晶圆尺寸：
8"/200mm
年份：
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
PVD配置
PVDOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
无文件