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说明
无说明配置
Die Bonder With: - 4 inch waffle pack holder - 2 inch waffle pack holder - 8 inch ring expander - Spare parts kit from OEM - Has a high force bond headOEM 型号描述
Automatic Die Attach System Accuracy ± 10 µm @ 3s Dual epoxy stamping / dispensing process Direct ceramic substrate indexing文件
ASM
AD838L-G2
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
76669
晶圆尺寸：
未知
年份：
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available