概述

The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform. The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle