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Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety cover配置
无配置OEM 型号描述
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
123087
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2009 SSIE
类别
Die Bonders / Sorters / Attachers
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
123087
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety cover配置
无配置OEM 型号描述
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.文件
无文件