说明
无说明配置
无配置OEM 型号描述
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.文件
无文件
BESI / ESEC
2100 xP
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
27595
晶圆尺寸：
未知
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
27595
晶圆尺寸：
未知
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.文件
无文件