说明
Die separator配置
无配置OEM 型号描述
2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.文件
无文件
DISCO
DDS2300
类别
Die Bonders / Sorters / Attachers
上次验证： 25 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128848
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Die separator配置
无配置OEM 型号描述
2008 Developed the "DDS2300" fully automatic die separator. Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.文件
无文件