概述

High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stresses