FLIP CHIP BONDER-A110
概述
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
活动的上架物品
1
服务
检验、保险、评估、物流
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.
1
检验、保险、评估、物流