BESTEM-D510
概述
High-speed, high-accuracy die bonder for IC and LSI compatible with 12 inch wafers. Wafer Size: Max φ12 inch
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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
